XC6SLX9-3FTG256I Manufacturers

We've been committed to offering easy,time-saving and money-saving one-stop purchasing service of consumer for XC6SLX9-3FTG256I, "Making the Merchandise of Significant Quality" could be the eternal goal of our firm. We make unremitting endeavours to know the aim of "We Will Always Keep in Pace using the Time".
XC6SLX9-3FTG256I, We've exported our solutions all over the world, especially the USA and European countries. Furthermore, all of our merchandise are manufactured with advanced equipment and strict QC procedures to ensure high quality.If you are interested in any of our products and solutions, please don't hesitate to contact us. We are going to try our best to meet your needs.

Hot Products

MT53E1G32D2FW-046WT:B
MT53E1G32D2FW-046WT:B is a type of DDR4 SDRAM module. It has a total capacity of 8GB and uses a 288-pin form factor. This module operates at a speed of 2400MHz and has a CAS latency of 17 clock cycles
KSZ9031RNXIA-TR
KSZ9031RNXIA-TR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
10M25DAF484C8G
10M25DAF484C8G is an FPGA (Field Programmable Gate Array) product produced by Altera (now acquired by Intel). This FPGA adopts FBGA484 package and has the following key features: Packaging form: FBGA484 packaging is used, which is a surface mount technology suitable for high-density integrated circuits. Working temperature range: The minimum working temperature is -40 ° C, and the maximum working temperature is 130 ° C, suitable for applications under various environmental conditions.
XCZU9CG-L1FFVC900I
XCZU9CG-L1FFVC900I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
EPM570F256I5N
EPM570F256I5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XC7Z015-2CLG485I
XC7Z015-2CLG485I is an SOC chip produced by Xilinx, which is an integrated system chip based on the Zynq-7000 architecture. The chip integrates a dual core ARM Cortex-A9 MPCore processor and CoreSight system, as well as an Artix-7 FPGA, with a total of 74K logic units and a running frequency of up to 766MHz

Related Blog
Reviews

High-precision multi-layer circuit board PCB proofing, four major production difficulties can not be ignored
Multi-layer PCBs are used as the "core main force" in the fields of communications, medical treatment, industrial control, security, automobiles, electric power, aviation, military industry, and computer peripherals. Product functions are getting higher and higher, and PCBs are getting more and more sophisticated, so relative to the difficulty of production Also getting bigger.
Definition of PCB
PCB (printed circuit board) is a printed circuit board, which is one of the important components of the electronics industry.
What are the uses of semiconductors
Application of semiconductor: components and integrated circuits made of semiconductor materials are important basic products of the electronic industry, and have been widely used in various aspects of electronic technology
DHI board surface treatment technology carbon series direct plating
This article will review the development history of carbon series direct plating technology, including new breakthroughs in equipment technology, and how to apply it to today's flagship mobile phones with extremely fine line width and line spacing.
This year, the cumulative sales of semiconductor equipment in Japan exceeded 75.6 billion, setting a record for the same period in history
According to the news from zhidongxi on June 28, according to money DJ in Taiwan, China, the cumulative sales of semiconductor equipment in Japan exceeded RMB 75.6 billion in May this year, the highest in the same period over the years
Addressing Coupling Capacitance in Designs
Parasitic coupling between different nets occurs through parasitic inductance and capacitance. Coupling capacitance defines how easily signals can transfer between nets to produce a return path, crosstalk, or overall circuit impedance. Front-end design features in your circuit simulator can help you examine how the coupling capacitance in your nets will influence signal behavior.

XC6SLX9-3FTG256I Manufacturers

Related Products

Hot Products

MT53E1G32D2FW-046WT:B

KSZ9031RNXIA-TR

10M25DAF484C8G

XCZU9CG-L1FFVC900I

EPM570F256I5N

XC7Z015-2CLG485I

High-precision multi-layer circuit board PCB proofing, four major production difficulties can not be ignored

Definition of PCB

What are the uses of semiconductors

DHI board surface treatment technology carbon series direct plating

This year, the cumulative sales of semiconductor equipment in Japan exceeded 75.6 billion, setting a record for the same period in history

Addressing Coupling Capacitance in Designs

Mona 2023-12-09 03:10:31

Victor 2023-09-17 16:49:35

Naomi 2021-02-12 22:34:18

Maud 2023-08-19 08:38:48

Maxine 2021-02-16 16:17:38

Nicola 2021-01-09 13:09:38

Send Inquiry

An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.