XC6SLX9-2FTG256C Manufacturers

That has a sound business credit history, outstanding after-sales service and modern producing facilities, we have earned an superb popularity amid our buyers across the planet for XC6SLX9-2FTG256C, We invites both you and your company to prosper together with us and share a brilliant long run in worldwide market place.
XC6SLX9-2FTG256C, Our company has already had a lot of top factories and expert technology teams in China, offering the best solutions, techniques and services to worldwide customers. Honesty is our principle, professional operation is our work, service is our goal, and customers' satisfaction is our future!

Hot Products

  • XCKU115-3FLVF1924E

    XCKU115-3FLVF1924E

    The XCKU115-3FLVF1924E field programmable gate array can achieve extremely high signal processing bandwidth in mid-range devices and next-generation transceivers. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system
  • XC6SLX16-2FTG256I

    XC6SLX16-2FTG256I

    XC6SLX16-2FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM1270F256I5N

    EPM1270F256I5N

    EPM1270F256I5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • XC7Z100-2FFG900I

    XC7Z100-2FFG900I

    XC7Z100-2FFG900I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX25T-2FGG484I

    XC6SLX25T-2FGG484I

    XC6SLX25T-2FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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