XC6SLX75T-3FGG484C Manufacturers

According to the use of high-end HDI board-3G board or IC carrier board, its future growth is very rapid: the world's 3G mobile phone growth will exceed 30% in the next few years, China will soon issue 3G licenses; IC carrier board industry consulting agency Prismark predicts China's forecasted growth rate from 2005 to 2010 is 80%, which represents the development direction of PCB technology. The following is about 2Step HDI PCB related, I hope to help you better understand 2Step HDI PCB.

Matte Black HDI PCB--Any hole with a diameter of less than 150um is called microvia in the industry, and the circuit made by this geometric technology of microvia can improve the benefits of assembly, space utilization, etc. At the same time, it also has the effect of miniaturization of electronic products. Its necessity. The following is about Matte Black HDI Circuit Board related, I hope to help you better understand Matte Black HDI Circuit Board.

​10AX066H3F34I2SG，Belonging to the Intel Arria 10 GX device series, this series combines high performance and power efficiency, manufactured using a 20nm process

5SGXMA4H2F35I3LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

​XCZU11EG-2FFVC1760I series is based on Xilinx ® UltraScale MPSoC architecture. This series of products integrates feature rich 64 bit quad core or dual core Arm in a single device ® Cortex-A53 and dual core Arm Cortex-R5F basic processing system (PS) and Xilinx programmable logic (PL) UltraScale architecture. In addition, it also includes on-chip memory, multi port external memory interfaces, and rich peripheral connection interfaces.

Half-hole HDI PCB is a compact product designed for small capacity users. It adopts modular parallel design, with a module capacity of 1000VA (height of 1U), natural cooling, and can be directly put into a 19 "rack, with a maximum of 6 modules in parallel. The product adopts full digital signal processing (DSP) technology and a number of patent technologies. It has a full range of load adaptability and strong short-term overload capacity, and can not consider the load power factor and peak factor.