XC6SLX45T-2FGG484C Manufacturers

Our commission should be to provide our end users and clients with very best excellent and aggressive portable digital products and solutions for XC6SLX45T-2FGG484C, We will do our greatest to meet or exceed customers' demands with top quality items, advanced concept, and productive and timely company. We welcome all customers.
XC6SLX45T-2FGG484C, We are sticking to excellent quality, competitive price and punctual delivery and better service, and sincerely hope to establish long-term good relationships and cooperation with our new and old business partners from all over the world. Sincerely welcome you to join us.

Hot Products

  • BCM56867A1IFSBG

    BCM56867A1IFSBG

    BCM56867A1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • H800-865K-A1

    H800-865K-A1

    H800-865K-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 24 Layers ELIC HDI PCB

    24 Layers ELIC HDI PCB

    24 Layers ELIC HDI PCB--When a printed circuit board is made into a final product, integrated circuits, transistors (triodes, diodes), passive components (such as resistors, capacitors, connectors, etc.) and various other electronic parts are mounted on it. The following is about 24 Layers of Any Connected HDI related, I hope to help you better understand 24 Layers of Any Connected HDI.
  • XC6SLX9-2CSG324C

    XC6SLX9-2CSG324C

    XC6SLX9-2CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10M25DAF484C8G

    10M25DAF484C8G

    ​10M25DAF484C8G is an FPGA (Field Programmable Gate Array) product produced by Altera (now acquired by Intel). This FPGA adopts FBGA484 package and has the following key features: Packaging form: FBGA484 packaging is used, which is a surface mount technology suitable for high-density integrated circuits. Working temperature range: The minimum working temperature is -40 ° C, and the maximum working temperature is 130 ° C, suitable for applications under various environmental conditions.
  • XCVU9P-L2FLGB2104E

    XCVU9P-L2FLGB2104E

    ​XCVU9P-L2FLGB2104E is a high-performance FPGA chip in Xilinx's Virtex UltraScale+series. The chip adopts advanced 28 nanometer high-K metal gate (HKMG) technology, combined with stacked silicon interconnect (SSI) technology, to achieve a perfect combination of low power consumption and high performance

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