XC6SLX16-2FTG256I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XC3S250E-4VQG100I

    XC3S250E-4VQG100I

    XC3S250E-4VQG100I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5M1270ZF256I5N

    5M1270ZF256I5N

    5M1270ZF256I5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP2AGX190EF29I5G

    EP2AGX190EF29I5G

    ​The EP2AGX190EF29I5G Arria ® II GX EP2AGX190EF29I5G FPGA provides stronger functionality for applications based on 6G transceivers.
  • 16-layer Rigid-Flex PCB

    16-layer Rigid-Flex PCB

    The designer of 16-layer Rigid-Flex PCB can use a single component to replace the composite printed circuit board which is composed of multiple connectors, multiple cables and ribbon cables. The performance is stronger and the stability is higher. At the same time, the scope of design is limited to one component, and the available space is optimized by bending and folding lines like a paper swan.
  • XCZU19EG-3FFVB1517E

    XCZU19EG-3FFVB1517E

    ​XCZU19EG-3FFVB1517E is an embedded system on chip (SoC) produced by Xilinx. This product belongs to the Zynq UltraScale+series and has the following key features and functions:
  • EP4SGX230FF35C4G

    EP4SGX230FF35C4G

    EP4SGX230FF35C4G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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