XC6SLX16-2FTG256I Manufacturers

The key to our success is "Good Solution Top quality, Reasonable Value and Efficient Service" for XC6SLX16-2FTG256I, Seeing believes! We sincerely welcome the new clients overseas to setup business enterprise interactions and also be expecting to consolidate the relationships while using the long-established prospects.
XC6SLX16-2FTG256I, There are advanced producing & processing equipment and skilled workers to ensure the merchandise with high quality. We now have found an excellent before-sale, sale, after-sale service to ensure the customers that could rest assured to make orders. Until now our goods are now moving on fast and very popular in South America, East Asia, the Middle east, Africa, etc.

Hot Products

  • XC7A50T-2CPG236I

    XC7A50T-2CPG236I

    ​The XC7A50T-2CPG236I Artix ® -7 series is optimized for low-power applications that require serial transceivers, high DSP, and logic throughput. Provide the lowest total material cost for high-throughput and cost sensitive applications
  • BCM54210SB0KMLG

    BCM54210SB0KMLG

    BCM54210SB0KMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EM-890K PCB

    EM-890K PCB

    IC testing is generally divided into physical Visual Inspecting Test, IC Functional Test, De-Capsulation, Solderbili, ty Test, Electrical Test, X-Ray, Rohs and FA.The following is about Large size EM-890K PCB related, I hope to help you better understand Large size EM-890K PCB.
  • BCM88470CB0KFSBG

    BCM88470CB0KFSBG

    BCM88470CB0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX16-2FTG256C

    XC6SLX16-2FTG256C

    XC6SLX16-2FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-2FLVA2104I

    XCVU7P-2FLVA2104I

    The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.

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