XC6SLX100T-3CSG484C Manufacturers

Our business sticks for the basic principle of "Quality could be the life with the firm, and track record will be the soul of it" for XC6SLX100T-3CSG484C, Only for accomplish the good-quality solution to meet customer's demand, all of our products and solutions have been strictly inspected before shipment.
XC6SLX100T-3CSG484C, We always stick to the tenet of "sincerity, high quality, high efficiency, innovation". With years of efforts, we've got established friendly and stable business relationships with worldwide customers. We welcome any of your inquiries and concerns for our solutions, and we're sure that we are going to offer just what you want, as we always believe that your satisfaction is our success.

Hot Products

EPM1270T144I5N
EPM1270T144I5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XC7S15-2FTGB196C
XC7S15-2FTGB196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XC7VX690T-2FFG1761C
XC7VX690T-2FFG1761C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
XC2S300E-6FG456C
XC2S300E-6FG456C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
10AX115N2F40E2LG
10AX115N2F40E2LG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
Multilayer Ceramic PCB
Multilayer Ceramic PCB substrate refers to a special process board where copper foil is directly bonded to the surface (single side or double side) of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The following is about Multilayer Ceramic Circuit Board related, I hope to help you better understand Multilayer Ceramic Circuit Board PCB.

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XC6SLX100T-3CSG484C Manufacturers

Related Products

Hot Products

EPM1270T144I5N

XC7S15-2FTGB196C

XC7VX690T-2FFG1761C

XC2S300E-6FG456C

10AX115N2F40E2LG

Multilayer Ceramic PCB

"Electronic Manufacturing Pavilion" of Shenzhen Electronic Equipment Association will become the new highlight of CITE2017

What are the total types of semiconductors

The Use of Semiconductors and Six Major Segmented Industries

Classification of electronic components

There is no limit to the production capacity of LCD panels

What are the advantages of flexible FPC circuit board

Dinah 2022-03-05 21:05:23

Janice 2023-12-24 01:36:25

Jamie 2022-12-10 01:46:26

Miguel 2024-11-04 03:57:50

Martha 2024-01-03 17:11:51

Kelly 2021-08-17 02:45:47

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.