XC3S200AN-4FT256I Manufacturers

We now have a specialist, efficiency workforce to deliver excellent service for our purchaser. We always follow the tenet of customer-oriented, details-focused for XC3S200AN-4FT256I, Besides, our firm sticks to high quality and affordable cost, and we also present great OEM companies to many famous brands.
XC3S200AN-4FT256I, Faced with the vitality of the global wave of economic integration, we are confident with our high-quality products and sincerely service to all our customers and wish we can cooperate with you to create a brilliant future.

Hot Products

  • XC7A100T-1CSG324I

    XC7A100T-1CSG324I

    XC7A100T-1CSG324I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56867A1IFSBG

    BCM56867A1IFSBG

    BCM56867A1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6VLX550T-3FFG1760C

    XC6VLX550T-3FFG1760C

    ​XC6VLX550T-3FFG1760C is a Virtex-6 series FPGA chip produced by Xilinx. The chip is packaged in FCBGA-1760, with 549888 logic units, supporting up to 1200 user input/output ports, and built-in 23298048 bit memory RAM. Its working power supply voltage range is 0.9V to 1.05V, a
  • Cross Blind Buried Hole PCB

    Cross Blind Buried Hole PCB

    PCB, also called printed circuit board, printed circuit board. Multi-layer printed board refers to a printed board with more than two layers. It is composed of connecting wires on several layers of insulating substrates and pads for assembling and soldering electronic components. The role of insulation.The following is about Cross Blind Buried Hole PCB related, I hope to help you better understand Cross Blind Buried Hole PCB.
  • HI-8435PQTF

    HI-8435PQTF

    HI-8435PQTF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 18 layer 3step HDI PCB

    18 layer 3step HDI PCB

    18 layer 3step HDI PCB refers to the HDI circuit board with more than 2 levels, usually 3 + N + 3 or 4 + N + 4 or 5 + N + 5 structure. The blind hole uses a laser, and the hole copper is about 15UM.The following is about 18 layer 3step HDI circuit board related, I hope to help you better understand 18 layer 3step HDI circuit board.

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