XCKU3P-2FFVB676E

XCKU3P-2FFVB676E is a high-performance FPGA (Field Programmable Gate Array) chip launched by Xilinx. This chip belongs to the UltraScale architecture and has excellent cost-effectiveness, performance, and power consumption performance, making it particularly suitable for applications such as packet processing, DSP functionality, wireless MIMO technology, Nx100G networks, and data centers. The XCKU3P-2FFVB676E chip integrates various high-end functions, such as transceiver, memory interface line rate, 100G connection chip, etc. It also supports multiple power options to balance system performance and required power. In addition, the chip also has a compact packaged logic unit, which helps to reduce dynamic power consumption