Products
Home > Products > IC Carrier Board

IC Carrier Board Manufacturers

"Control the standard by the details, show the power by quality". Our firm has strived to establish a extremely efficient and stable employees crew and explored an effective excellent command method for IC Carrier Board,BT board,COF board,ultra-thin BT PCB, We will do our best to meet your requirements and are sincerely looking forward to developing mutual beneficial business relationship with you!
IC Carrier Board, We pay high attention to customer service, and cherish every customer. We now have maintained a strong reputation in the industry for many years. We've been honest and work on building a long-term relationship with our customers.

Related Products

Hot Products

  • BCM56321B1KFSBG

    BCM56321B1KFSBG

    ​BCM56321B1KFSBG is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • XCVU7P-2FLVA2104I

    XCVU7P-2FLVA2104I

    The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.
  • 6-Layer HDI PCB

    6-Layer HDI PCB

    Electronic design is constantly improving the performance of the whole machine, but also trying to reduce its size. From mobile phones to smart weapons, "small" is the eternal pursuit. High density integration (HDI) technology can make terminal product design more miniaturized, while meeting higher standards of electronic performance and efficiency. Welcome to buy 6-Layer HDI PCB from us.
  • Megtron7 PCB

    Megtron7 PCB

    Megtron7 PCB--Panasonic automotive and Industrial Systems Corporation announced on May 28, 2014 that it has developed a low loss multilayer substrate material "Megtron 7" for high-end servers, routers and supercomputers with large capacity and high-speed transmission. The relative permittivity of the product is 3.3 (at 1GHz) and the dielectric loss tangent is 0.001 (at 1GHz). Compared with the original product "Megtron 6", the transmission loss is reduced by 20%.
  • XCVU13P-3FIGD2104E

    XCVU13P-3FIGD2104E

    ​XCVU13P-3FIGD2104E is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, with the following features and specifications: Number of logic elements: There are 3780000 logic elements (LE). Adaptive Logic Module (ALM): Provides 216000 ALMs. Embedded memory: Built in 94.5 Mbit of embedded memory. Number of input/output terminals: Equipped with 752 I/O terminals.
  • HI-1573PST

    HI-1573PST

    HI-1573PST ​Features:Dual Channel Transceiver: The HI-1573PST is a dual transceiver that provides separate transmit and receive HI-1573PST channels for MIL-STD-1553 data bus communication.MIL-STD-1553 Compliant: Compliant with MIL-STD-1553A and B, as well as ARINC 708A standards, ensuring compatibility with military and aerospace systems.3.3V
  • Related Blog
  • Reviews

Send Inquiry