HT7049 FPC Manufacturers

XC3S400-5TQ144C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

EP3C80U484I7N is a field programmable gate array (FPGA) chip designed by Altera. It has 484 I/O pins and supports multiple input/output interfaces such as LVDS, LVCMOS, LVTTL, etc. In addition, EP3C80F484I7N also has strong logical processing capabilities, which can implement various complex digital signal processing algorithms

​5SGXMA3H2F35C2LN is an FPGA (Field Programmable Gate Array) product produced by Intel Corporation, belonging to the Stratix V GX series. This FPGA has 957 logic units (LABs) and 432 input/output (I/O) terminals, making it suitable for applications that require highly programmable logic solutions.

XCKU035-1FBVA676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

XC2S50E-6PQ208I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

​XCVU5P-1FLVB2104I is an FPGA chip produced by Xilinx, belonging to the UltraScale+series. This chip integrates up to 1.5 million system logic units and utilizes second-generation 3D integrated circuit technology to integrate multiple PCI Express Gen3 cores, improving system performance