Medical ultrasound probe FPC Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • 5SGXMA3H2F35C2N

    5SGXMA3H2F35C2N

    ​5SGXMA3H2F35C2N is a Stratix V GX series FPGA chip designed and produced by Intel. This chip belongs to the Stratix V GX series, with 340000 logic units and 1152 terminals, suitable for high-performance applications such as data centers, communications, and computer vision.
  • BCM65551B1IFSBG

    BCM65551B1IFSBG

    BCM65551B1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3SD1800A-4CSG484C

    XC3SD1800A-4CSG484C

    XC3SD1800A-4CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AS022C4U19E3LG

    10AS022C4U19E3LG

    ​10AS022C4U19E3LG is an electronic component, specifically belonging to Intel's package type 484-BFBGA batch 24+products. This component may be a programmable logic device, microprocessor, integrated circuit (IC), or other type of electronic component used in various electronic devices
  • XC3S250E-4VQG100I

    XC3S250E-4VQG100I

    XC3S250E-4VQG100I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7S75-1FGGA676I

    XC7S75-1FGGA676I

    ​XC7S75-1FGGA676I is a Xilinx chip belonging to the Spartan-7 series, manufactured using 28 nanometer technology. It is a field programmable logic array (FPGA) chip with various excellent features. XC7S75-1FGGA676I is equipped with MicroBlaze ™ A soft processor that can achieve performance of over 200 DMIPs and support DDR3 at 800Mb/s.

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