HI-8598PSTF Manufacturers

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Hot Products

  • XCVU7P-2FLVC2104I

    XCVU7P-2FLVC2104I

    ​XCVU7P-2FLVC2104I is an FPGA (Field Programmable Gate Array) product launched by Xilinx, belonging to Virtex ™ UltraScale+™ device series. This series of devices provides high-performance and highly integrated functionality on 14nm/16nm FinFET nodes
  • XCZU9EG-2FFVC900I

    XCZU9EG-2FFVC900I

    XCZU9EG-2FFVC900I is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 600,000 logic cells, 34.6 Mb of block RAM, and 1,248 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications.
  • XC7K160T-3FFG676E

    XC7K160T-3FFG676E

    XC7K160T-3FFG676E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC3S400-4FGG456C

    XC3S400-4FGG456C

    ​XC3S400-4FGG456C is an FPGA chip produced by Xilinx and belongs to the Spartan-3 series. This chip has multiple significant features that make it widely used in multiple fields.
  • 5CGXFC7D6F27I7N

    5CGXFC7D6F27I7N

    5CGXFC7D6F27I7N is a field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor company. This device features 622,080 logic elements, 27 Mb of RAM, and 1,500 user input/output pins. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as single-ended I/O,
  • EM-890K PCB

    EM-890K PCB

    IC testing is generally divided into physical Visual Inspecting Test, IC Functional Test, De-Capsulation, Solderbili, ty Test, Electrical Test, X-Ray, Rohs and FA.The following is about Large size EM-890K PCB related, I hope to help you better understand Large size EM-890K PCB.

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