HI-6138PQTF Manufacturers

XC3S400-4FTG256C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

​The XC7Z030-2SBG485I Zynq-7000 device is equipped with a dual core ARM Cortex-A9 processor, which is compatible with 28nm Artix7 or Kinex based processors ™ The programmable logic integration of 7 can achieve excellent performance to power ratio and maximum design flexibility. The Zynq 7000 device has a logic unit of up to 6.25M and transceivers ranging from 6.6Gb/s to 12.5Gb/s, which can achieve highly differentiated design for many embedded applications such as multi camera driver assistance systems and 4K2K ultra high definition televisions

XC7Z030-2FBG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

​XCZU19EG-2FFVD1760I Zynq® UltraScale+ ™ MPSoC multiprocessors have 64 bit processor scalability, combining real-time control with software and hardware engines, suitable for graphics, video, waveform, and packet processing applications. This multiprocessor system on chip device is based on a platform equipped with a general-purpose real-time processor and programmable logic

​XCVU095-1FFVA2104I is an FPGA chip produced by Xilinx, belonging to the UltraScale architecture series. This chip is packaged in FCBGA 2104 and features high-performance FPGA logic that can be configured as distributed memory. It has 36Kb dual port block RAM and built-in FIFO logic for on-chip data bufferin

XC7K355T-3FFG901E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.