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The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    XCKU11P-2FFVE1517I

    XCKU11P-2FFVE1517I The XCKU11P-2FFFVE1517I field programmable array has multiple power options to achieve the best balance between required system performance and extremely low power consumption. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system
  • ultra-thin BT PCB

    ultra-thin BT PCB

    ultra-thin BT PCB--Solid State Drive (Solid State Disk or Solid State Drive, referred to as SSD), commonly known as solid state drive, solid state drive is a hard disk made of solid state electronic storage chip array, because the solid state capacitor in Taiwan English is called Solid.The following is about Ultra Thin SSD Card PCB related, I hope to help you better understand Ultra Thin SSD Card PCB.
  • 10CL120YF484I7G

    10CL120YF484I7G

    10CL120YF484I7G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications. 10CL120YF484I7G is commonly used in applications such as industrial automation, gaming, and low-power embedded systems. The device is known for its low power consumption, low cost, and high processing capacity, making it an excellent choice for applications where cost and power consumption are critical factors.
  • XC2C384-10TQG144I

    XC2C384-10TQG144I

    XC2C384-10TQG144I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S50A-4VQG100I

    XC3S50A-4VQG100I

    XC3S50A-4VQG100I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU9P-L2FLGA2577E

    XCVU9P-L2FLGA2577E

    XCVU9P-L2FLGA2577E is a Virtex UltraScale+ FPGA chip from Xilinx. It features 924,480 logic cells and 3600 DSP units, and utilizes 16nm FinFET+ process technology.
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    XCVU9P-L2FLGA2577E adopts the advanced Virtex UltraScale+architecture and is a member of this series of chips.

  • PCB proofing layout setting skills

    PCB proofing, as a component of high-precision electronic products, has been a very common existence in life. However, we all know that domestic professional PCB proofing design needs different point settings in different stages, and large grid points will be used for device layout in the layout stage. Let's take a look at the detailed PCB proofing layout setting skills.

  • Detailed explanation of Multilayer PCB laminated structure

    Before designing multi-layer PCB circuit board, the designer needs to first determine the circuit board structure according to the scale of the circuit, the size of the circuit board and the requirements of electromagnetic compatibility (EMC),

  • How to choose reliable PCB manufacturers for cooperation

    The rise of 5g has driven the innovation, creation and rapid development of the global 3C industry. When more iterations of terminal products become very frequent and rapid, the common development of all core enterprises in the industrial chain becomes very important. 3C products focus on the quality effect and service life. Therefore, the parts and components in the products are very important. As one of the indispensable suppliers in the industrial chain, the buyer is also cautious in choosing.

  • Advantages and disadvantages of multilayer boards

    Multilayer boards were invented in 1961. Its production method is generally to make the inner layer graphics first, and then use the printing and etching method to make a single-sided or double-sided substrate, and incorporate it into the designated interlayer, and then heat, press and bond it. As for the subsequent drilling, It is the same as the plated through-hole method of the double-sided board.

  • Why HDI PCB needs to be browned and what is its function？

    We all know that there are many procedures for making HDI PCB from the planned feeding to the final step. One of the processes is called browning. Some people may ask what is the role of browning?

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