DS25BR150TSD/NOPB Manufacturers

To constantly improve the management system by virtue of the rule of "sincerely, good faith and quality are the base of enterprise development", we widely absorb the essence of related products internationally, and constantly develop new products to meet the demands of customers for DS25BR150TSD/NOPB, We warmly welcome you to set up cooperation and generate a bright long term together with us.
DS25BR150TSD/NOPB, we've been sincerely hope to establish one good long term business relationship with your esteemed company thought this opportunity, based on equal, mutual beneficial and win win business from now till the future.

Hot Products

  • 14-layer Rigid - Flex PCB

    14-layer Rigid - Flex PCB

    14-layer Rigid - Flex PCB The rigid-flex board is also called rigid-flex board. With the birth and development of FPC, the new product of rigid-flex circuit board (soft and hard combined board) is gradually being widely used in various occasions.The following is about 14 layer Rigid - Flex PCB related, I hope to help you better understand 14 layer Rigid - Flex PCB.
  • XCKU3P-2FFVB676E

    XCKU3P-2FFVB676E

    ​XCKU3P-2FFVB676E is a high-performance FPGA (Field Programmable Gate Array) chip launched by Xilinx. This chip belongs to the UltraScale architecture and has excellent cost-effectiveness, performance, and power consumption performance, making it particularly suitable for applications such as packet processing,
  • XC3S400AN-4FGG400I

    XC3S400AN-4FGG400I

    XC3S400AN-4FGG400I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC5VLX30-3FFG676C

    XC5VLX30-3FFG676C

    XC5VLX30-3FFG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU125-3FLVB1760E

    XCVU125-3FLVB1760E

    XCVU125-3FLVB1760E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EM-888 7MM Thick PCB

    EM-888 7MM Thick PCB

    EM-888 7MM Thick PCB--As user applications require more and more board layers, alignment between layers becomes very important. Alignment between layers requires tolerance convergence. As the board size changes, this convergence requirement is more demanding. All layout processes are generated in a controlled temperature and humidity environment. The following is about EM888 7MM Thick PCB related, I hope to help you better understand EM888 7MM Thick PCB.

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