BCM89887A1AFBG Manufacturers

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BCM89887A1AFBG, Our goods are produced with the best raw materials. Every moment, we constantly improve the production programme. In order to ensure better quality and service, we have been focusing on the production process. We have now got high praise by partner. We're looking forward to establishing business relationship with you.

Hot Products

  • BCM68380IFSBG

    BCM68380IFSBG

    BCM68380IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AS016E3F29I2SG

    10AS016E3F29I2SG

    10AS016E3F29I2SG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCZU21DR-2FFVD1156I

    XCZU21DR-2FFVD1156I

    Overview of XCZU21DR-2FFVD1156I RF Data Converter Subsystem Most Zynq UltraScale+RFSoCs include an RF data converter subsystem that includes multiple radios Frequency analog-to-digital converter (RF-ADC) and multiple RF analog-to-digital converters Converter (RF-DAC). High precision, high-speed, and energy-efficient RF-ADC and RF-DAC Can be configured separately for real data, or in most cases can be configured in pairs for real and imaginary numbers
  • XC6SLX45T-3FGG484I

    XC6SLX45T-3FGG484I

    XC6SLX45T-3FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2VP20-6FF1152I

    XC2VP20-6FF1152I

    XC2VP20-6FF1152I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Multilayer PCB circuit board

    Multilayer PCB circuit board

    Multilayer PCB circuit board--The manufacturing method of multilayer board is generally made by the inner layer pattern first, and then the single or double-sided substrate is made by printing and etching method, which is included in the designated interlayer, and then heated, pressurized and bonded. As for the subsequent drilling, it is the same as the plating through-hole method of double-sided plate. It was invented in 1961.

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