BCM65937A0IFSBG Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XC6SLX45-2CSG484I

    XC6SLX45-2CSG484I

    XC6SLX45-2CSG484I has 43661 logic components, 2.04 Mbit embedded memory, minimum operating temperature bit -40 C, maximum operating temperature bit+100 C. Provide industry-leading connectivity features such as high logic pin ratio, small-sized packaging, MicroBlaze? Soft processors, and various supported I/O protocols. It is an ideal choice for advanced bridging applications in consumer products, automotive information and entertainment systems, and industrial automation applications
  • BCM56160B0IFSBG

    BCM56160B0IFSBG

    BCM56160B0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56150A0KFSBLG

    BCM56150A0KFSBLG

    BCM56150A0KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A35T-2CPG236C

    XC7A35T-2CPG236C

    XC7A35T-2CPG236C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S50E-6FTG256C

    XC2S50E-6FTG256C

    XC2S50E-6FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX115N3F40I2LG

    10AX115N3F40I2LG

    10AX115N3F40I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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