Products
Home > Products > VT-47 communication high speed PCB

VT-47 communication high speed PCB Manufacturers

"Sincerity, Innovation, Rigorousness, and Efficiency" could be the persistent conception of our organization for your long-term to establish alongside one another with shoppers for mutual reciprocity and mutual benefit for VT-47 communication high speed PCB,VT-481 HDI PCB,VT-411C CIT400 PCB,High-speed backplane,VT-47 High-speed PCB, As a key business of this industry, our company makes endeavours to become a leading supplier, based on the faith of specialist quality & throughout the world company.
VT-47 communication high speed PCB, Our company promises: reasonable prices, short production time and satisfactory after-sales service, we also welcome you to visit our factory at any time you want. Wish we've got a pleasant and long terms business together!!!

Related Products

Hot Products

  • XC6SLX9-2CPG196C

    XC6SLX9-2CPG196C

    XC6SLX9-2CPG196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM65500B1IFSBG

    BCM65500B1IFSBG

    BCM65500B1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TPS3808G33QDBVRQ1

    TPS3808G33QDBVRQ1

    TPS3808G33QDBVRQ1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU35P-3FSVH2104E

    XCVU35P-3FSVH2104E

    XCVU35P-3FSVH2104E is an electronic component, specifically an FPGA (Field Programmable Gate Array) chip produced by Xilinx. The following is a detailed introduction about XCVU35P-3FSVH2104E
  • XC9572XL-7TQG100C

    XC9572XL-7TQG100C

    XC9572XL-7TQG100C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5SGXMA4H2F35I3LN

    5SGXMA4H2F35I3LN

    5SGXMA4H2F35I3LN is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Related Blog
  • Reviews

  • Some Important Properties of Semiconductors

    Why does the resistivity of semiconductor go down with temperature？Between the conductor and semiconductor resistivity difference is due to the different density of charge carriers.

  • Development history of electronic components

    The development history of electronic components is actually a condensed history of electronic development. Electronic technology is an emerging technology developed at the end of the 19th century and the beginning of the 20th century. It has developed most rapidly and widely used in the 20th century, and has become an important symbol of the development of modern science and technology.

  • The source of the name of the HDI Board

    HDI in HDI Board is the abbreviation of High Density Interconnector. It is a kind of (technology) for producing printed circuit boards. It uses micro-blind and buried via technology for a circuit board with a relatively high line distribution density. HDI is a compact product designed for small-capacity users.

  • Difference between missing printing covering layer and laminated covering film of FPC circuit board

    After the covering film of FPC circuit board is positioned, it is necessary to heat and pressurize to make the adhesive completely solidified and integrated with the circuit.

  • What are electronic components

    Electronic components are components of electronic components and small machines and instruments. They are often composed of several parts and can be used in similar products; It often refers to some parts of electrical appliances, radios, meters and other industries, and is the general

  • Printed circuit boards can be seen everywhere. Do you know how difficult it is to make them

    In the production of electronic products, there will be a production process of printed circuit board. Printed circuit boards are used in electronic products in all industries. It is the carrier of electronic schematic diagram that can realize the design function and turn the design into physical products

Send Inquiry