High-speed backplane Manufacturers

Our rewards are lessen selling prices,dynamic sales team,specialized QC,solid factories,high quality services for High-speed backplane,Tachyon 100G PCB,P95 high speed PCB,P96 high speed PCB,P25 high speed PCB, "Making the Merchandise of Significant Quality" could be the eternal goal of our firm. We make unremitting endeavours to know the aim of "We Will Always Keep in Pace using the Time".
High-speed backplane, Based on our automatic production line, steady material purchase channel and quick subcontract systems have been built in mainland China to meet customer's wider and higher requirement in recent years. We have been looking forward to cooperating with more clients worldwide for common development and mutual benefit!Your trust and approval are the best reward for our efforts. Keeping honest, innovative and efficient, we sincerely expect that we can be business partners to create our brilliant future!

Hot Products

  • BCM88370CB0KFSBG

    BCM88370CB0KFSBG

    BCM88370CB0KFSBG is a high-performance and highly integrated electronic component suitable for various application scenarios that require high-speed data transmission and complex network communication processing
  • XC4VFX12-10SFG363I

    XC4VFX12-10SFG363I

    XC4VFX12-10SFG363I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S200A-4FTG256I

    XC3S200A-4FTG256I

    XC3S200A-4FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU5P-2FFVB676I

    XCKU5P-2FFVB676I

    XCKU5P-2FFVB676I is a high-performance FPGA (Field-Programmable Gate Array) chip from Xilinx's Kintex UltraScale+ family. It features 5.3 million logic cells, 113 Mb of UltraRAM and 2,722 DSP slices, and utilizes the 20nm process technology with FinFET+ technology, providing high performance and energy efficiency.
  • AP7164E Rigid-Flex PCB

    AP7164E Rigid-Flex PCB

    8-Layers AP7164E Rigid-Flex PCB is mainly used in various products such as mobile phones, digital cameras, tablets, notebook computers, wearable devices and so on. The application of FPC flexible circuit boards in smart phones accounts for a large proportion. Our company can skillfully produce multi-layer fpc, soft-hard combination fpc, multi-layer HDI soft-hard combination board. It has stable cooperation with HP, Dell, Sony, etc.
  • EP1S30F780I6N

    EP1S30F780I6N

    EP1S30F780I6N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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