Products
Home > Products > Rogers PCB

Rogers PCB Manufacturers

We've got a highly efficient group to deal with inquiries from shoppers. Our purpose is "100% client fulfillment by our product high-quality, price tag & our staff service" and enjoy a superb reputation amongst clientele. With quite a few factories, we will provide a wide variety of Rogers PCB,RF PCB,22Layer RF PCB,TU-752 PCB,High-speed PCB, Initial enterprise, we understand each other. Additional enterprise, the trust is getting there. Our firm usually at your service anytime.
Rogers PCB, We are proud to supply our items to every costumer all around the world with our flexible, fast efficient services and strictest quality control standard which has always approved and praised by customers.

Related Products

Hot Products

  • Meg6 High-speed Backplane

    Meg6 High-speed Backplane

    32-Layer Meg6 High-speed Backplane With the large-scale improvement of system design complexity and integration, electronic system designers are engaged in circuit design above 100MHZ. The operating frequency of the bus has reached or exceeded 50MHZ, and some even exceeded 100MHZ. The following is about 32 Layer Meg6 High-speed Backplane related, I hope to help you better understand 32 Layer Meg6 High-speed Backplane.
  • XC7S15-2CPGA196I

    XC7S15-2CPGA196I

    ​XC7S15-2CPGA196I Spartan ® -7 Field Programmable Gate Array adopts 28 nanometer technology and is equipped with MicroBlaze ™ Soft processor, running over 200 DMIPs, supporting 800Mb/s DDR3
  • BCM56867A1IFSBG

    BCM56867A1IFSBG

    BCM56867A1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU37P-2FSVH2892E

    XCVU37P-2FSVH2892E

    ​XCVU37P-2FSVH2892E is a high-performance FPGA (Field Programmable Gate Array) product launched by Xilinx, belonging to the Virtex UltraScale+series. This FPGA chip has demonstrated outstanding performance and application potential in multiple fields due to its powerful computing power and flexible programming characteristics.
  • Rogers antenna PCB

    Rogers antenna PCB

    Rogers antenna PCB has high dielectric constant, large loss and good heat dissipation, so it is widely used in high-power and small-volume devices.The following is about GE Rogers antenna , I hope to help you better understand GE Rogers antenna .
  • 10AX027H4F34I3SG

    10AX027H4F34I3SG

    ​10AX027H4F34I3SG is an Arria 10 GX field programmable gate array (FPGA) integrated circuit. Higher performance than the previous generation of mid to high end FPGAs. Realize high energy efficiency through a complete set of energy-saving technologies.
  • Related Blog
  • Reviews

  • Differences Between Through-Hole Technologies for Flexible Circuit Boards

    The difference between the excimer laser and the impact carbon dioxide laser through-hole of the flexible circuit board:

  • Development history of electronic components

    The development history of electronic components is actually a condensed history of electronic development. Electronic technology is an emerging technology developed at the end of the 19th century and the beginning of the 20th century. It has developed most rapidly and widely used in the 20th century, and has become an important symbol of the development of modern science and technology.

  • What Are Multilayer Boards?

    Multi-layer PCB is a circuit board composed of more than two layers of electrical layer (copper foil layer) superimposed on each other. The copper layers are bonded together by layers of resin.

  • What are electronic components

    Electronic components are components of electronic components and small machines and instruments. They are often composed of several parts and can be used in similar products; It often refers to some parts of electrical appliances, radios, meters and other industries, and is the general

  • Current status of semiconductor chips in China

    What is the status of Chinese chips On June 9, 2021, at the world semiconductor conference, Wu Hanming, an academician of the Chinese Academy of engineering, pointed out the current situation of China's chips: China still needs 8 SMIC's if it wants to complete the localization and replacement of chips. In short, now China needs 8 SMIC's

  • What are the challenges and opportunities faced by fingerprint identification FPC in the development of 5G in the United States

    The US Government Accountability Office (GAO) released a technology assessment and analysis report entitled "5G Wireless Technology" (hereinafter "Report"), which outlines the basic situation of 5G, summarizes the opportunities that 5G can bring, and finally analyzes the United States. Challenges in deploying 5G.

Send Inquiry