EM-370 HDI PCB Manufacturers

"Control the standard by the details, show the power by quality". Our firm has strived to establish a extremely efficient and stable employees crew and explored an effective excellent command method for EM-370 HDI PCB,EM-888 HDI PCB,EM-888K HDI PCB,EM-890 HDI PCB,EM-891 HDI PCB, We will do our best to meet your requirements and are sincerely looking forward to developing mutual beneficial business relationship with you!
EM-370 HDI PCB, We've exported our solutions all over the world, especially the USA and European countries. Furthermore, all of our merchandise are manufactured with advanced equipment and strict QC procedures to ensure high quality.If you are interested in any of our products and solutions, please don't hesitate to contact us. We are going to try our best to meet your needs.

Hot Products

  • BCM56565B0KFSBG

    BCM56565B0KFSBG

    BCM56565B0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4CE15F23I8LN

    EP4CE15F23I8LN

    EP4CE15F23I8LN is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP2AGX190FF35I3G

    EP2AGX190FF35I3G

    EP2AGX190FF35I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM65500B1IFSBG

    BCM65500B1IFSBG

    BCM65500B1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU37P-L2FSVH2892E

    XCVU37P-L2FSVH2892E

    XCVU37P-L2FSVH2892E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-3FLVC2104E

    XCVU7P-3FLVC2104E

    ​XCVU7P-3FLVC2104E also supports humidity sensitivity and adapts to different working environment requirements. The packaging form of this chip is BGA, which provides powerful logic processing capability and high-speed data transmission rate,

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