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No matter new shopper or old customer, We believe in very long expression and dependable relationship for BT Board,Ic carrier,Ic substrate,BT PCB,DS7409 PCB, We sincerely stay up for hearing from you. Give us a chance to show you our professionalism and passion. We've been sincerely welcome superior mates from numerous circles at dwelling and overseas come to cooperate!
BT Board, Our product quality is one of the major concerns and has been produced to meet the customer's standards. "Customer services and relationship" is another important area which we understand good communication and relationships with our customers is the most significant power to run it as a long term business.

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    ​XC3S1600E-4FGG320C is an FPGA (Field Programmable Gate Array) belonging to the Spartan-3E series, designed specifically to meet the needs of high-capacity, cost sensitive consumer electronics products. It has the following key characteristics:
  • XC6SLX16-2FTG256C

    XC6SLX16-2FTG256C

    XC6SLX16-2FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 8 Layer Robot HDI PCB

    8 Layer Robot HDI PCB

    HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and direct laser drilling are used. The following is about 8 Layer Robot HDI PCB related, I hope to help you better understand 8 Layer Robot HDI PCB.
  • 5CEFA9U19I7N

    5CEFA9U19I7N

    ​The 5CEFA9U19I7N Cyclone VE FPGA has been optimized to have the lowest system cost and power consumption, making it suitable for various general-purpose logic and DSP applications.
  • XCVU9P-1FLGC2104I

    XCVU9P-1FLGC2104I

    ​XCVU9P-1FLGC2104I is an FPGA (Field Programmable Gate Array) chip, specifically belonging to Xilinx's product line. Here is a brief introduction to the chip:
  • XCZU6EG-1FFVC900E

    XCZU6EG-1FFVC900E

    ​XCZU6EG-1FFVC900E - Zynq® UltraScale+ ™ MPSoC multi-core processor
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  • Reviews

  • How Does an Integrated Circuit (IC) Work?

    ​An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

  • What is an integrated circuit?

    An Integrated Circuit (IC), also commonly known as a microchip or chip, is a miniaturized electronic circuit that consists of multiple interconnected semiconductor devices, such as transistors, diodes, resistors, and capacitors, fabricated on a single semiconductor substrate, usually made of silicon. The components on an integrated circuit are designed to perform specific electronic functions, and the entire circuit is manufactured as a single unit.

  • Introduction to semiconductors

    After the invention and mass production of transistors, various solid-state semiconductor components such as diodes and transistors were widely used, replacing the functions and roles of vacuum tubes in circuits. By the middle and late 20th century

  • What is a high-speed circuit

    It is generally considered that if the frequency of the digital logic circuit reaches or exceeds 45MHZ~50MHZ, and the circuit working above this frequency has accounted for a certain amount of the entire electronic system (for example, 1/3), it is called a high-speed circuit.

  • What Are Multilayer Boards?

    Multi-layer PCB is a circuit board composed of more than two layers of electrical layer (copper foil layer) superimposed on each other. The copper layers are bonded together by layers of resin.

  • Current status of semiconductor chips in China

    What is the status of Chinese chips On June 9, 2021, at the world semiconductor conference, Wu Hanming, an academician of the Chinese Academy of engineering, pointed out the current situation of China's chips: China still needs 8 SMIC's if it wants to complete the localization and replacement of chips. In short, now China needs 8 SMIC's

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