Ic substrate Manufacturers

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Hot Products

  • XC7VX690T-2FFG1761C

    XC7VX690T-2FFG1761C

    XC7VX690T-2FFG1761C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7K325T-1FFG900C

    XC7K325T-1FFG900C

    ​XC7K325T-1FFG900C is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • EP1S25F672C7N

    EP1S25F672C7N

    EP1S25F672C7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2AGX95EF35I5G

    EP2AGX95EF35I5G

    EP2AGX95EF35I5G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E The device provides the highest performance and integrated functionality on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements
  • 5CEFA7U19I7N

    5CEFA7U19I7N

    ​5CEFA7U19I7N is an FPGA field programmable logic device, and Cyclone ® V devices can simultaneously meet the requirements of decreasing power consumption, cost, and time to market, as well as the increasing bandwidth requirements of large-scale and cost sensitive applications.

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