8-layer robot 3-step HDI PCB Manufacturers

We've been committed to offering easy,time-saving and money-saving one-stop purchasing service of consumer for 8-layer robot 3-step HDI PCB,8-layer 2-step drone HDI PCB,HD camera HDI PCB,HDI PCB, We can do your customized order to meet your own satisfactory! Our company sets up several departments, including production department, sales department, quality control department and sevice center, etc.
8-layer robot 3-step HDI PCB, We accomplish this by exporting our wigs directly from our own factory to you. The goal of our company is to get customers who enjoy coming back to their business. We sincerely hope to cooperate with you in the near future. If there's any opportunity, welcome to visit our factory!!!

Hot Products

  • XC6SLX100-2FG484I

    XC6SLX100-2FG484I

    XC6SLX100-2FG484I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7V585T-1FFG1761l

    XC7V585T-1FFG1761l

    XC7V585T-1FFG1761l is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Ladder PCB

    Ladder PCB

    Ladder PCB technology can reduce the thickness of PCB locally, so that the assembled devices can be embedded in the thinning area, and realize the bottom welding of ladder, so as to achieve the purpose of overall thinning.
  • HI-1579PST

    HI-1579PST

    HI-1579PST is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC9572XL-10VQG44I

    XC9572XL-10VQG44I

    XC9572XL-10VQG44I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A35T-1CPG236C

    XC7A35T-1CPG236C

    XC7A35T-1CPG236C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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