5CGXFC5F6M11I7N Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • EP3C16F256I7N

    EP3C16F256I7N

    EP3C16F256I7N Hongtai Quick Electronics, 100% in stock, with a complete range of products, only produces original products with a reputation of 15 years, just to provide a safe and reliable electronic component procurement platform
  • 5M2210ZF256C5N

    5M2210ZF256C5N

    5M2210ZF256C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AD5933YRSZ-REEL7

    AD5933YRSZ-REEL7

    AD5933YRSZ-REEL7 ICs, Processors, Microcontrollers ADI/ADI/Analog Package SSOP-16_208mil
  • EP2AGZ350HF40I3G

    EP2AGZ350HF40I3G

    EP2AGZ350HF40I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU035-1FFVA1156C

    XCKU035-1FFVA1156C

    ​XCKU035-1FFVA1156C is an FPGA chip launched by Xilinx and belongs to the Kintex UltraScale series. This chip adopts a 16 nanometer process and is packaged in FCBGA with 318150 logic units and 1156 pins, making it widely used in high-performance computing and communication applications
  • 5CEBA2F23C8N

    5CEBA2F23C8N

    ​The design of 5CEBA2F23C8N can simultaneously meet the decreasing power consumption, cost, and time to market requirements, as well as the increasing bandwidth demands of high-capacity and cost sensitive applications. Due to the integration of transceivers and hard memory controllers

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