5AGTMC3D3F31I3G Manufacturers

In the past few years, our company absorbed and digested advanced technologies both at home and abroad. Meanwhile, our company staffs a team of experts devoted to the development of 5AGTMC3D3F31I3G, We, with great passion and faithfulness, are prepared to present you with best companies and striding forward along with you to create a dazzling upcoming.
5AGTMC3D3F31I3G, With the enterprising spirit of"" high efficiency, convenience, practicality and innovation"", and in line with such serving guidance of ""good quality but better price, "" and ""global credit"", we're striving to cooperate with the automobile parts companies all over the world to make a win-win partnership.

Hot Products

  • XCKU5P-L2FFVB676E

    XCKU5P-L2FFVB676E

    XCKU5P-L2FFVB676E is a high-performance FPGA (Field Programmable Gate Array) product launched by Xilinx. This FPGA belongs to the Kintex UltraScale+series and has the following features and specifications
  • Meg6 High-speed Backplane

    Meg6 High-speed Backplane

    32-Layer Meg6 High-speed Backplane With the large-scale improvement of system design complexity and integration, electronic system designers are engaged in circuit design above 100MHZ. The operating frequency of the bus has reached or exceeded 50MHZ, and some even exceeded 100MHZ. The following is about 32 Layer Meg6 High-speed Backplane related, I hope to help you better understand 32 Layer Meg6 High-speed Backplane.
  • XC95288XL-7TQ144I

    XC95288XL-7TQ144I

    XC95288XL-7TQ144I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 16-layer Rigid-Flex PCB

    16-layer Rigid-Flex PCB

    The designer of 16-layer Rigid-Flex PCB can use a single component to replace the composite printed circuit board which is composed of multiple connectors, multiple cables and ribbon cables. The performance is stronger and the stability is higher. At the same time, the scope of design is limited to one component, and the available space is optimized by bending and folding lines like a paper swan.
  • XCVU47P-2FSVH2892E

    XCVU47P-2FSVH2892E

    XCVU47P-2FSVH2892E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU025-1FFVA1156I

    XCKU025-1FFVA1156I

    ​XCKU025-1FFVA1156I is an ideal choice for packet processing and DSP intensive functions, suitable for various applications ranging from wireless MIMO technology to Nx100G networks and data centers.

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