32-layer 3step HDI PCB Manufacturers

"Based on domestic market and expand abroad business" is our improvement strategy for 32-layer 3step HDI PCB,28-layer 3step HDI PCB,20-layer 6step HDI PCB,2step HDI PCB,3step HDI PCB, Now we have established steady and long business relationships with customers from North America, Western Europe, Africa, South America, more than 60 countries and regions.
32-layer 3step HDI PCB, Our aim is to help customers realize their goals. We have been making great efforts to achieve this win-win situation and sincerely welcome you to join us. In a word, when you choose us, you choose a perfect life. Welcome to visit our factory and welcome your order! For further inquiries, remember to do not hesitate to contact us.

Hot Products

  • XC7Z020-1CLG400I

    XC7Z020-1CLG400I

    ​The XC7Z020-1CLG400I embedded system on chip (SoC) adopts a dual core ARM Cortex-A9 processor configuration, integrating 7 series programmable logic (up to 6.6M logic units and 12.5Gb/s transceiver), providing highly differentiated design for various embedded applications.
  • Red High speed Backplane

    Red High speed Backplane

    Traditionally, for reliability reasons, passive components have tended to be used on the backplane. However, in order to maintain the fixed cost of the active board, more and more active devices such as BGA are designed on the backplane.The following is about Red High speed Backplane. related, I hope to help you better understand Red High speed Backplane.
  • XC6SLX75T-3FGG484I

    XC6SLX75T-3FGG484I

    XC6SLX75T-3FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX1140T-2FLG1928C

    XC7VX1140T-2FLG1928C

    XC7VX1140T-2FLG1928C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7A200T-L2FFG1156E

    XC7A200T-L2FFG1156E

    XC7A200T-L2FFG1156E is an Artix-7 series FPGA chip produced by Xilinx. The chip is based on a 28 nanometer high-performance low-power (HPL) process, providing 215360 logic units and 500 I/O ports, supporting data rates up to 6.6Gb/s, and built-in 16 high-speed transceivers.
  • XC7K160T-2FFG676C

    XC7K160T-2FFG676C

    XC7K160T-2FFG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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