24-Layer Buried capacitance PCB Manufacturers

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Hot Products

  • 10-Layer ELIC HDI PCB

    10-Layer ELIC HDI PCB

    10-Layer ELIC HDI PCB In order to avoid confusion, the American IPC Circuit Board Association proposed to call this kind of product technology a common name for HDI (High Density Intrerconnection) technology. If it is directly translated, it will become a high-density interconnection technology. The following is about 10-Layer ELIC HDI PCB related, I hope to help you better understand 10-Layer ELIC HDI PCB.
  • XCZU5CG-1FBVB900E

    XCZU5CG-1FBVB900E

    XCZU5CG-1FBVB900E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU11P-2FFVD900I

    XCKU11P-2FFVD900I

    ​XCKU11P-2FFVD900I is an electronic component that belongs to the FPGA (Field Programmable Gate Array) core board integrated circuit board category. It has a specific specification model, manufactured by Alinx, with a purchase date of January 2022 and a quantity of 100 units.
  • EP2C5F256C8N

    EP2C5F256C8N

    EP2C5F256C8N is a powerful FPGA chip with multiple unique features and advantages. ‌
  • 10AX027E3F29E2SG

    10AX027E3F29E2SG

    ​10AX027E3F29E2SG is an FPGA (Field Programmable Gate Array) product produced by Altera (now acquired by Intel), with the specific model being Arria 10 GX 270. This FPGA has the following features and specifications
  • EP2AGX190FF35I3G

    EP2AGX190FF35I3G

    EP2AGX190FF35I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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