10AX027E3F29E2SG Manufacturers

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Hot Products

  • XC3S1200E-4FGG400C

    XC3S1200E-4FGG400C

    XC3S1200E-4FGG400C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Metal with mixture PCB

    Metal with mixture PCB

    Metal with mixture PCB The metal substrate is a metal circuit board material, which is a general electronic component. It is composed of a thermally conductive insulating layer, a metal plate and a metal foil. It has special magnetic permeability, excellent heat dissipation, high mechanical strength, and good processing performance. The following is about Biggs Aluminum PCB related, I hope to help you better understand Biggs Aluminum PCB.
  • BCM56445B0IFSBG

    BCM56445B0IFSBG

    BCM56445B0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • LTC4365ITS8#TRMPBF

    LTC4365ITS8#TRMPBF

    LTC4365ITS8#TRMPBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU7EV-2FBVB900I

    XCZU7EV-2FBVB900I

    XCZU7EV-2FBVB900I is an SoC (System on Chip) from Xilinx's Zynq UltraScale+ MPSoC (Multi-Processor System on Chip) series. This chip features a heterogeneous processing architecture combining programmable logic and processing units of ARMv8 64-bit processors, providing a high level of performance and flexibility to developers.
  • Half-hole HDI PCB

    Half-hole HDI PCB

    Half-hole HDI PCB is a compact product designed for small capacity users. It adopts modular parallel design, with a module capacity of 1000VA (height of 1U), natural cooling, and can be directly put into a 19 "rack, with a maximum of 6 modules in parallel. The product adopts full digital signal processing (DSP) technology and a number of patent technologies. It has a full range of load adaptability and strong short-term overload capacity, and can not consider the load power factor and peak factor.

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