10-layer ELIC HDI PCB Manufacturers

Our growth depends to the superior products ,great talents and repeatedly strengthened technology forces for 10-layer ELIC HDI PCB,ELIC Rigid-Flex PCB,12-layer ELIC HDI PCB,8-layer ELIC HDI PCB,6-layer ELIC HDI PCB, We have been not pleased while using the present achievements but we're trying finest to innovate to satisfy buyer's more personalized needs. No matter where you are from, we're here to wait for your type request, and welcom to visit our manufacturing unit. Choose us, you can satisfy your dependable supplier.
10-layer ELIC HDI PCB, We strive for excellence, constant improvement and innovation, is committed to make us the "customer trust" and the "first choice of engineering machinery accessories brand" suppliers. Choose us, sharing a win-win situation!

Hot Products

  • XC6SLX9-3FTG256C

    XC6SLX9-3FTG256C

    XC6SLX9-3FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU095-2FFVC2104E

    XCVU095-2FFVC2104E

    ​The XCVU095-2FFVC2104E device provides optimal performance and integration at 20nm, including serial I/O bandwidth and logic capacity. As the only high-end FPGA in the 20nm process node industry, this series is suitable for applications ranging from 400G networks to large-scale ASIC prototype design/simulation.
  • XCKU3P-2SFVB784I

    XCKU3P-2SFVB784I

    XCKU3P-2SFVB784I is a Field-Programmable Gate Array (FPGA) chip from Xilinx's Kintex UltraScale+ family, which is a high-performance FPGA designed with advanced features and capabilities. The chip features 2.6 million logic cells, 2604 DSP slices, and 47 Mb UltraRAM, and is built using a 20nm process technology
  • XC6SLX75T-2CSG484C

    XC6SLX75T-2CSG484C

    XC6SLX75T-2CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM7256AETC144-10N

    EPM7256AETC144-10N

    EPM7256AETC144-10N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • ADXRS300ABG

    ADXRS300ABG

    ADXRS300ABG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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