XCZU9CG-2FFVC900I Manufacturers

​5SGXMA3H2F35I2N is an FPGA (Field Programmable Gate Array) chip from Intel (formerly Altera), belonging to the Stratix V GX series. This chip has high performance and flexibility, suitable for a variety of complex application scenarios. The following is a brief introduction to 5SGXMA3H2F35I2N

XC7S50-1CSGA324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

N7000-1 PCB is a kind of high temperature resistant polyimide PCB produced by nelco in Singapore. Its main application field is aviation and maritime communication industry. It has high temperature resistance, low temperature resistance, good water absorption and strong stability. It is a high frequency material with BT property and easy to process

​EPM570T144C5N is a microcontroller produced by ALTERA In addition, EPM570T144C5N also supports RoHS standards, ensuring the environmental friendliness of the product. These characteristics make it suitable for various application scenarios that require high-performance microcontrollers

​5CGXFC7D6F27C7N is a Cyclone V GX series FPGA chip produced by Intel (formerly Altera). The chip is packaged in FBGA-672 and has 149500 logic units and 336 I/O ports, supporting system programmability and reprogramming. Its working power supply voltage range is 1.07V to 1.13V

XCVU37P-3FSVH2892E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.