XC7K325T-3FFG900E is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 325,200 Logic Cells, operates at a speed of up to 500 MHz, and features 2,160 Kbit of Block RAM, 180 DSP Slices, and 32 high-speed transceiver channels. It is commonly used in a range of applications, including high-performance networking, computing, and signal processing. The "3FF" model designation indicates that this FPGA features triple analog/digital interfaces, the "G900" package type indicates the use of a Flip-Chip BGA package with 900 balls, and the "E" temperature designation indicates the use of an extended operating temperature range of -40°C to 100°C.
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