XCZU49DR-2FFVF1760I Manufacturers

We insist over the principle of enhancement of 'High high quality, Efficiency, Sincerity and Down-to-earth working approach' to offer you with superb assistance of processing for XCZU49DR-2FFVF1760I, We're incredibly proud with the excellent name from our shoppers for our products' trustworthy quality.
XCZU49DR-2FFVF1760I, To keep the leading position in our industry, we never stop challenging the limitation in all aspects to create the ideal products. In his way, We can enrich our life style and promote a better living environment for the global community.

Hot Products

  • AP9111R Rigid-Flex PCB

    AP9111R Rigid-Flex PCB

    The AP9111R Rigid-Flex PCB combines the advantages of the rigid characteristics of the rigid circuit board and the bendable characteristics of the flexible board, so that the PCB is no longer a two-dimensional plane layer of oil, but is folded by a three-dimensional internal connection and arbitrary bending. The following is about 12 Layer 8R4F Rigid Flex Board related, I hope to help you better understand 12 Layer AP9111R Rigid-Flex PCB.
  • XCS40XL-4PQG208C

    XCS40XL-4PQG208C

    XCS40XL-4PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU13P-2FHGA2104I

    XCVU13P-2FHGA2104I

    XCVU13P-2FHGA2104I is a scalable and reconfigurable acceleration platform suitable for optimizing complex workloads. It has a large amount of raw computing power and I/O flexibility, suitable for computationally intensive workloads in data center applications
  • Multilayer Ceramic PCB

    Multilayer Ceramic PCB

    Multilayer Ceramic PCB substrate refers to a special process board where copper foil is directly bonded to the surface (single side or double side) of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The following is about Multilayer Ceramic Circuit Board related, I hope to help you better understand Multilayer Ceramic Circuit Board PCB.
  • XC5VFX130T-1FFG1738I

    XC5VFX130T-1FFG1738I

    XC5VFX130T-1FFG1738I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 88E1112-C2-NNC1I000

    88E1112-C2-NNC1I000

    88E1112-C2-NNC1I000 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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