XCZU49DR-2FFVF1760I Manufacturers

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XCZU49DR-2FFVF1760I, To keep the leading position in our industry, we never stop challenging the limitation in all aspects to create the ideal products. In his way, We can enrich our life style and promote a better living environment for the global community.

Hot Products

  • N4000-13 PCB

    N4000-13 PCB

    N4000-13 PCB is a kind of High Performance PCB produced by nelco in Singapore. Its main application fields are aviation and communication industry. It has high temperature resistance, low temperature resistance, good water absorption and strong stability
  • EP4SGX230KF40I3N

    EP4SGX230KF40I3N

    ​EP4SGX230KF40I3N is a type of FPGA (Field Programmable Gate Array) made by Intel (formerly Altera). This specific FPGA has 230,000 Logic Elements, operates at a speed of up to 800 MHz, and features 17 Mb of embedded memory, 1,080 DSP blocks, and 24 high-speed transceiver channels.
  • XC7VX690T-3FFG1927C

    XC7VX690T-3FFG1927C

    XC7VX690T-3FFG1927C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S400AN-4FGG400I

    XC3S400AN-4FGG400I

    XC3S400AN-4FGG400I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Ladder PCB

    Ladder PCB

    Ladder PCB technology can reduce the thickness of PCB locally, so that the assembled devices can be embedded in the thinning area, and realize the bottom welding of ladder, so as to achieve the purpose of overall thinning.
  • XC7S50-2CSGA324C

    XC7S50-2CSGA324C

    XC7S50-2CSGA324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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