XCZU47DR-2FFVE1156I Manufacturers

We believe in: Innovation is our soul and spirit. Quality is our life. Shopper need is our God for XCZU47DR-2FFVE1156I, To acquire a consistent, profitable, and constant development by getting a aggressive advantage, and by continuously increasing the value added to our shareholders and our employee.
XCZU47DR-2FFVE1156I, We aim to build a famous brand which can influence a certain group of people and light up the whole world. We want our staff to realize self-reliance, then achieve financial freedom, lastly obtain time and spiritual freedom. We do not focus on how much fortune we can make, instead we aim to obtain high reputation and be recognized for our products and solutions. As a result, our happiness comes from our clients satisfaction rather than how much money we earn. Ours team will do best in your case always.

Hot Products

  • XCVU080-H1FFVA2104E

    XCVU080-H1FFVA2104E

    ​XCVU080-H1FFVA2104E is an FPGA (Field Programmable Gate Array) produced by AMD/Xilinx. This FPGA has multiple power options to achieve the best balance between required system performance and extremely low power consumption.
  • 10M08DAU324C8G

    10M08DAU324C8G

    ​10M08DAU324C8G is a high-performance FPGA (Field Programmable Gate Array) chip, belonging to the Intel MAX 10 series, with the following features and advantages:
  • 5CGXFC9E6F35C7N

    5CGXFC9E6F35C7N

    ​5CGXFC9E6F35C7N is an FPGA chip belonging to the Cyclone V GX series produced by Intel (formerly known as Altera). This chip has the following characteristics and parameters:
  • ST115G PCB

    ST115G PCB

    ST115G PCB -- with the development of integrated technology and microelectronic packaging technology, the total power density of electronic components is growing, while the physical size of electronic components and electronic equipment is gradually tending to be small and miniaturized, resulting in rapid accumulation of heat, resulting in the increase of heat flux around the integrated devices. Therefore, high temperature environment will affect the electronic components and devices This requires a more efficient thermal control scheme. Therefore, the heat dissipation of electronic components has become a major focus in the current electronic components and electronic equipment manufacturing.
  • EP1C6F256C8N

    EP1C6F256C8N

    EP1C6F256C8N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC95288XV-7FG256I

    XC95288XV-7FG256I

    XC95288XV-7FG256I is an integrated circuit (IC), specifically belonging to the category of programmable logic devices, produced by Xilinx. This product has 288 macro units with a propagation delay of 10ns, and is packaged in BGA with a size of 256 pins

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