XCZU47DR-2FFVE1156I Manufacturers

We believe in: Innovation is our soul and spirit. Quality is our life. Shopper need is our God for XCZU47DR-2FFVE1156I, To acquire a consistent, profitable, and constant development by getting a aggressive advantage, and by continuously increasing the value added to our shareholders and our employee.
XCZU47DR-2FFVE1156I, We aim to build a famous brand which can influence a certain group of people and light up the whole world. We want our staff to realize self-reliance, then achieve financial freedom, lastly obtain time and spiritual freedom. We do not focus on how much fortune we can make, instead we aim to obtain high reputation and be recognized for our products and solutions. As a result, our happiness comes from our clients satisfaction rather than how much money we earn. Ours team will do best in your case always.

Hot Products

  • High TG PCB

    High TG PCB

    In 1961, Hazelting Corp. of the United States published Multiplanar, which was the first pioneer in the development of multilayer boards. This method is almost the same as the method of manufacturing multilayer boards by using the through-hole method. After Japan stepped into this field in 1963, various ideas and manufacturing methods related to multi-layer boards were gradually spread all over the world. The following is about 14 Layer High TG PCB related, I hope to help you better understand 14 Layer High TG PCB.
  • XC7A200T-1FFG1156C

    XC7A200T-1FFG1156C

    ​XC7A200T-1FFG1156C is an FPGA chip produced by Xilinx, belonging to the Artix-7 series. This chip is manufactured using advanced 28nm technology and has strong processing performance. Specific features include
  • Large size Drone PCB

    Large size Drone PCB

    The unmanned aerial vehicle is referred to as "UAV" for short, or "UAV" for short. It is an unmanned aircraft operated by radio remote control equipment and self-provided program control device, or it is operated completely or intermittently by an on-board computer.The following is about Large size Drone PCB related, I hope to help you better understand Large size Drone PCB.
  • RO3003 PCB

    RO3003 PCB

    The delay per unit inch on the PCB is 0.167ns. However, if there are more vias, more device pins, and more constraints set on the network cable, the delay will increase. Generally, the signal rise time of high-speed logic devices is about 0.2ns. If there are GaAs chips on the board, the maximum wiring length is 7.62mm. The following is about RO3003 PCB related, I hope to help you better understand RO3003 PCB.
  • EP4SGX360FF35C3N

    EP4SGX360FF35C3N

    ​EP4SGX360FF35C3N is a type of FPGA (Field Programmable Gate Array) made by Intel (formerly Altera). This specific FPGA has 360,000 Logic Elements, operates at a speed of up to 840 MHz, and features 31.8 Mb of embedded memory,
  • XC6SLX45T-3FGG484C

    XC6SLX45T-3FGG484C

    XC6SLX45T-3FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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