Products
Home > Products > XCZU43DR-1FFVE1156E

XCZU43DR-1FFVE1156E Manufacturers

We generally continually give you quite possibly the most conscientious shopper company, and the widest variety of designs and styles with finest materials. These endeavours include the availability of customized designs with speed and dispatch for XCZU43DR-1FFVE1156E, We welcome buyers everywhere in the word to get in touch with us for future business enterprise interactions. Our merchandise are the most effective. Once Selected, Ideal Forever!
XCZU43DR-1FFVE1156E, we're sincerely hope to establish one good long term business relationship with your esteemed company thought this opportunity, based on equal, mutual beneficial and win win business from now till the future.

Related Products

Hot Products

  • XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E The device provides the highest performance and integrated functionality on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements
  • XC7VX980T-1FF1930C

    XC7VX980T-1FF1930C

    XC7VX980T-1FF1930C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7V585T-2FFG1761C

    XC7V585T-2FFG1761C

    XC7V585T-2FFG1761C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU35P-L2FSVH2104E

    XCVU35P-L2FSVH2104E

    ​XCVU35P-L2FSVH2104E is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, which has the characteristics of high performance and high programmability. This chip uses Virtex ® The UltraScale+architecture provides excellent performance and power ratio,
  • XC6SLX100T-2CSG484C

    XC6SLX100T-2CSG484C

    XC6SLX100T-2CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • MAX1363EUB+

    MAX1363EUB+

    MAX1363EUB+ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • How to design the lamination when designing a 4-layer PCB circuit board

    When designing a four layer PCB circuit board, how to design the stack? Theoretically, there can be three schemes

  • Introduction of chip

    Chip, also known as microcircuit, microchip, integrated circuit (IC). It refers to the silicon chip containing integrated circuits, which is very small and often part of computers or other electronic equipment.

  • Is Semiconductor Spring Coming? What is the current situation and future development trend of the industry?

    Recently, the semiconductor industry has received much attention. Morgan Stanley recently released a report stating that the deflation of the technology industry, coupled with long-term demand for artificial intelligence semiconductors, will trigger the next industry upward cycle for logic semiconductors. This news has inspired the semiconductor industry, and some people believe that the spring of semiconductors is not far away. So, let's analyze the current situation and future of the semiconductor industry.

  • What is the C chip

    IC chip (integrated circuit) is an integrated circuit formed by putting a large number of microelectronic components (transistors, resistors, capacitors, diodes, etc.) on a plastic base to make a chip. At present, almost all chips can be called IC chips.

  • Why should PCB be cleaned?

    When troubleshooting non-functional or poorly performing circuits, engineers can usually run simulations or other analysis tools to consider the circuit from the schematic level.

  • Foxconn changes cage to Phoenix and wants to regain market with 8K

    Guo Taiming described its acquisition of Sharp and the introduction of 8K display technology as a replacement for the phoenix. Whether this phoenix can bring Guo Taiming the expected growth and prompt Foxconn to regain the market is still to be verified.

Send Inquiry