XCZU25DR-1FFVG1517E Manufacturers

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XCZU25DR-1FFVG1517E, Abiding by our motto of "Hold well the quality and services, Customers Satisfaction", So we provide our clients with high quality products and excellent service. Please feel free to contact us for further information.

Hot Products

  • XC6SLX100-2FGG676I

    XC6SLX100-2FGG676I

    ​XC6SLX100-2FGG676I is an FPGA chip launched by Xilinx, belonging to the CoolRunner II series. This chip has the following characteristics and advantages:
  • XC7VX485T-2FFG1927I

    XC7VX485T-2FFG1927I

    XC7VX485T-2FFG1927I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC5VLX20T-1FF323C

    XC5VLX20T-1FF323C

    XC5VLX20T-1FF323C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC95144XL-7TQG144I

    XC95144XL-7TQG144I

    XC95144XL-7TQG144I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 8 Layer Robot HDI PCB

    8 Layer Robot HDI PCB

    HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and direct laser drilling are used. The following is about 8 Layer Robot HDI PCB related, I hope to help you better understand 8 Layer Robot HDI PCB.
  • XCVU35P-1FSVH2104E

    XCVU35P-1FSVH2104E

    ​XCVU35P-1FSVH2104E is an FPGA (Field Programmable Gate Array) product manufactured by Xilinx. Here is a brief introduction to the product:

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