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XCZU15EG-1FFVC900I Manufacturers

Attaining consumer satisfaction is our firm's purpose for good. We'll make wonderful efforts to produce new and top-quality merchandise, meet up with your special necessities and supply you with pre-sale, on-sale and after-sale products and services for XCZU15EG-1FFVC900I, Our aim is to help customers realize their goals. We are making great efforts to achieve this win-win situation and sincerely welcome you to join us.
XCZU15EG-1FFVC900I, During in 11 years, We have participated in more than 20 exhibitions, obtains the highest praise from each customer. Our company has been devoting that "customer first" and committed to helping customers expand their business, so that they become the Big Boss !

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    8-layer rigid-Flex PCB has the characteristics of bending and folding, so it can be used to make customized circuit, maximize the indoor available space, use this point, reduce the space occupied by the whole system, the overall cost of rigid Flex PCB will be relatively high, but with the continuous maturity and development of the industry, the overall cost will continue to reduce, so it will be more cost-effective and competitive power.
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    XCZU5EG-2SFVC784I

    ​The XCZU5EG-2SFVC784I MPSoC multiprocessor has 64 bit processor scalability, combining real-time control with software and hardware engines, suitable for graphics, video, waveform, and packet processing applications. This multiprocessor on-chip system device is based on a platform equipped with a universal real-time processor and programmable logic.
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    5AGTMD3G3F31I3N

    5AGTMD3G3F31I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
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    XC6SLX75T-3FGG676C is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. It offers a large number of logic cells, distributed memory, and DSP slices, making it suitable for a wide range of applications. This device has 74,880 logic cells, 3.5 Mb of distributed RAM, 180 DSP slices, and 8 clock management tiles.
  • XCVU125-3FLVB1760E

    XCVU125-3FLVB1760E

    XCVU125-3FLVB1760E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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