XCZU11EG-2FFVC1760E Manufacturers

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XCZU11EG-2FFVC1760E, We provide good quality but unbeatable low price and the best service. Welcome to post your samples and color ring to us .We are going to produce the items according to your request. If you are interested in any items we offer, please feel free to contact us directly by mail, fax, telephone or internet. We've been here to answer your questions from Monday to Saturday and looking forward to cooperating with you.

Hot Products

  • XCVU7P-1FLVA2104I

    XCVU7P-1FLVA2104I

    ​XCVU7P-1FLVA2104I is a Virtex ® UltraScale+Field Programmable Gate Array (FPGA) IC, with the highest performance and integrated functionality. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements.
  • XCKU040-2FBVA676E

    XCKU040-2FBVA676E

    ​XCKU040-2FBVA676E is a Kintex based ® The UltraScale architecture FPGA (Field Programmable Gate Array) chip is produced by AMD (formerly Xilinx). It has high performance and flexible programmability, suitable for a wide range of application fields such as data centers
  • EP3SE80F1152I4N

    EP3SE80F1152I4N

    ​EP3SE80F1152I4N is an FPGA (Field Programmable Gate Array) integrated circuit (IC) manufactured by Intel. The following is a detailed introduction about EP3SE80F1152I4N:
  • HI-3584PQIF

    HI-3584PQIF

    ​The HI-3584PQIF from Holt Integrated Circuits is a highly enhanced silicon gate CMOS device designed specifically for interfacing a 16-bit parallel data bus with the ARINC 429 serial bus. This device offers numerous improvements over the industry-standard HI-8282 architecture,
  • XCVU13P-2FHGB2104E

    XCVU13P-2FHGB2104E

    XCVU13P-2FHGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 1.3 million logic cells, 50 Mb of block RAM, and 624 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications such as high-performance computing, machine vision, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 1 GHz. The device comes in a flip-chip BGA (FHGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU13P-2FHGB2104E is commonly used in advanced systems such as wireless communications, cloud computing, and high-speed networking. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.
  • BCM56445B0IFSBG

    BCM56445B0IFSBG

    BCM56445B0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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