Products
Home > Products > XCVU7P-L2FLVC2104E

XCVU7P-L2FLVC2104E Manufacturers

"Control the quality by the details, show the strength by quality". Our company has strived to establish a highly efficient and stable staff team and explored an effective quality control process for XCVU7P-L2FLVC2104E, We sincerely welcome buddies to negotiate business enterprise and start cooperation with us. We hope to join hands with good friends in different industries to produce a brilliant long term.
XCVU7P-L2FLVC2104E, Our company has built stable business relationships with many well-known domestic companies as well as oversea customers. With the goal of providing high quality products to customers at low cots, we've been committed to improving its capacities in research, development, manufacturing and management. We have honored to receive recognition from our customers. Till now we have now passed ISO9001 in 2005 and ISO/TS16949 in 2008. Enterprises of "quality of survival, the credibility of development" for the purpose, sincerely welcome domestic and foreign businessmen to visit to discuss cooperation.

Related Products

Hot Products

  • XC7Z045-2FFG900I

    XC7Z045-2FFG900I

    ​The Xilinx XC7Z045-2FFG900I Zynq ® -7000 SoC first generation architecture is a flexible platform that provides a fully programmable alternative to traditional ASIC and SoC users while launching new solutions. ARM® Cortex ™-
  • TU-943N High-speed PCB

    TU-943N High-speed PCB

    TU-943N High-speed PCB -- the development of electronic technology is changing with each passing day. This change mainly comes from the progress of chip technology. With the wide application of deep submicron technology, semiconductor technology is becoming increasingly physical limit. VLSI has become the mainstream of chip design and application.
  • XC3S250E-4TQG144I

    XC3S250E-4TQG144I

    XC3S250E-4TQG144I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AP8535R Rigid-Flex PCB

    AP8535R Rigid-Flex PCB

    AP8535R Rigid-Flex PCB is a new type of printed circuit board that combines the durability of a rigid PCB and the adaptability of a flexible PCB. Among all types of PCBs, the combination of 18 Layers Rigid-Flex PCB is the most resistant to harsh application environments, so Favored by manufacturers of industrial control, medical and military equipment, companies in the mainland are also gradually increasing the proportion of rigid-flex boards in total output.
  • XCR3384XL-12FT256I

    XCR3384XL-12FT256I

    XCR3384XL-12FT256I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XQR5VFX130-1CN1752V

    XQR5VFX130-1CN1752V

    Model XQR5VFX130-1CN1752V, Brand: XILINX Package: FCBGA-1752, working temperature: -40-125 Batch number: 2018+，Hot sale all over the world
  • Related Blog
  • Reviews

  • Characteristics of semiconductors

    Semiconductor has the following characteristics: dopability, thermal sensitivity, photosensitivity, negative resistivity temperature, and rectifiability.

  • HDI board application

    HDI is widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured by the build-up method.

  • Circuit thinning drives high-end micro-drill business opportunities

    Due to the continuous introduction of thin, light and short products in the market, the high-function, high-speed and other double-height era has been developed, and the trend of high-frequency, high-speed, and multi-IO chips has been developed.

  • FPC circuit board manufacturing process

    Flow chart of single-sided FPC circuit board: engineering documents - copper foil - Pretreatment - press dry film - exposure - Development - etching - film stripping - AOI - Pretreatment - coating film (or ink printing) - pretreatment before electroplating - electroplating - post electroplating - reinforcement - appearance punching - electrical measurement - appearance inspection - shipment;

  • Analysis of the Current Development Status and Prospects of Semiconductor Application Industry in China

    In the 1980s, China began to enter the semiconductor industry. In the early days, semiconductor technology mainly relied on imports, while China mainly engaged in simple assembly and testing work. At that time, major enterprises such as Shanghai Hongli and East China Semiconductor had a significant gap between their product technology level and the international advanced level, but it laid the foundation for the Chinese semiconductor industry

  • Advantages of HDI PCB

    1. It can reduce the cost of HDI PCB: When the density of PCB increases to more than eight-layer board, it is manufactured with HDI, and its cost will be lower than that of the traditional complex pressing process.

Send Inquiry