XCVU57P-2FSVK2892E Manufacturers

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XCVU57P-2FSVK2892E, With high quality, reasonable price, on-time delivery and customized & customized services to help customers achieve their goals successfully, our company has got praise in both domestic and foreign markets. Buyers are welcome to contact us.

Hot Products

  • S25FL127SABMFI101

    S25FL127SABMFI101

    Cypress memory chip, S25FL127SABMFI101, stock supply, price advantage, complete models, original quality assurance. Focus on electronic components spot distribution, BOM matching, large-scale stock supply, authentic guarantee!
  • XC4VLX60-10FF668C

    XC4VLX60-10FF668C

    XC4VLX60-10FF668C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU5EV-2SFVC784I

    XCZU5EV-2SFVC784I

    XCZU5EV-2SFVC784I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2C50F672C8N

    EP2C50F672C8N

    EP2C50F672C8N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU7P-3FLVC2104E

    XCVU7P-3FLVC2104E

    ​XCVU7P-3FLVC2104E also supports humidity sensitivity and adapts to different working environment requirements. The packaging form of this chip is BGA, which provides powerful logic processing capability and high-speed data transmission rate,
  • BCM60350KRFBG

    BCM60350KRFBG

    BCM60350KRFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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