XCVU19P-2FSVB3824E Manufacturers

"Sincerity, Innovation, Rigorousness, and Efficiency" would be the persistent conception of our enterprise with the long-term to establish together with clients for mutual reciprocity and mutual benefit for XCVU19P-2FSVB3824E,XILINX,FBGA-3824E,XCVU19P, Our main objectives are to deliver our clients worldwide with good quality, competitive cost, happy delivery and superb providers.
XCVU19P-2FSVB3824E, All styles appear on our website are for customizing. We meet up to individual requirements with all solutions of your very own styles. Our concept is to help presenting the confidence of each buyers with the offering of our most sincere service, and the right product.

Hot Products

  • 10AS022C4U19E3LG

    10AS022C4U19E3LG

    ​10AS022C4U19E3LG is an electronic component, specifically belonging to Intel's package type 484-BFBGA batch 24+products. This component may be a programmable logic device, microprocessor, integrated circuit (IC), or other type of electronic component used in various electronic devices
  • TPS2052BDRBR

    TPS2052BDRBR

    TPS2052BDRBR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • CY15B104Q-LHXIT

    CY15B104Q-LHXIT

    CY15B104Q-LHXIT is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2SGX30DF780C5N

    EP2SGX30DF780C5N

    EP2SGX30DF780C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Multilayer precision PCB

    Multilayer precision PCB

    Multilayer precision PCB--The manufacturing method of multilayer board is generally made by the inner layer pattern first, and then the single or double-sided substrate is made by printing and etching method, which is included in the specified interlayer, and then heated, pressurized and bonded. As for the subsequent drilling, it is the same as the plating through-hole method of double-sided board.
  • XC5VLX330-2FF1760C

    XC5VLX330-2FF1760C

    XC5VLX330-2FF1760C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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