XCVU13P-2FHGB2104E Manufacturers

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XCVU13P-2FHGB2104E, Facing fierce global market competition, we have launched the brand building strategy and updated the spirit of ""human-oriented and faithful service"", with an aim to gain global recognition and sustainable development.

Hot Products

  • 5CGXFC7D6F27C7N

    5CGXFC7D6F27C7N

    ​5CGXFC7D6F27C7N is a Cyclone V GX series FPGA chip produced by Intel (formerly Altera). The chip is packaged in FBGA-672 and has 149500 logic units and 336 I/O ports, supporting system programmability and reprogramming. Its working power supply voltage range is 1.07V to 1.13V
  • HI-8282APJI

    HI-8282APJI

    HI-8282APJI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • N9000-13RF PCB

    N9000-13RF PCB

    N9000-13rf PCB is a RF substrate developed by nelco company in Singapore. It is FR4 and easy to process. Its application field is usually communication industry
  • 5CSEMA4U23I7N

    5CSEMA4U23I7N

    ​5CSEMA4U23I7N is a SoC FPGA chip produced by Altera (now part of Intel Programmable Solutions Group). The chip is packaged in UBGA-672 and features an ARM Cortex A9 core with a dual core design. It supports a maximum clock frequency of up to 925MHz and is equipped with abundant logic elements and memory resources
  • EP4SGX110HF35C3G

    EP4SGX110HF35C3G

    EP4SGX110HF35C3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCF16PFSG48C

    XCF16PFSG48C

    XCF16PFSG48C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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