XCVU13P-2FHGB2104E Manufacturers

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Hot Products

  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • XCVU27P-2FSGA2577E

    XCVU27P-2FSGA2577E

    ​XCVU27P-2FSGA2577E is an FPGA chip produced by Xilinx, belonging to the Virtex UltraScale series. This chip has the characteristics of high performance and low power consumption, and is suitable for various application scenarios, such as data centers, communications, industrial control,
  • XC7Z007S-1CLG225I

    XC7Z007S-1CLG225I

    XC7Z007S-1CLG225I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Hard gold PCB

    Hard gold PCB

    Hard gold PCB--plating gold can be divided into hard gold and soft gold. Because the hard gold plating is an alloy, the hardness is relatively hard. It is suitable for use in places where friction is required. It is generally used as a contact point on the edge of the PCB (commonly known as gold fingers).The following is about Hard gold plated PCB related, I hope to help you better understand Hard gold plated PCB.
  • XC5VLX330-2FF1760C

    XC5VLX330-2FF1760C

    XC5VLX330-2FF1760C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU19EG-2FFVD1760I

    XCZU19EG-2FFVD1760I

    ​XCZU19EG-2FFVD1760I Zynq® UltraScale+ ™ MPSoC multiprocessors have 64 bit processor scalability, combining real-time control with software and hardware engines, suitable for graphics, video, waveform, and packet processing applications. This multiprocessor system on chip device is based on a platform equipped with a general-purpose real-time processor and programmable logic

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