XCVP1802-2MSEVSVA5601 Manufacturers

XC7VX980T-2FFG1930I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

XC5VSX50T-3FFG665C is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 49,920 logic cells, 2.7 Mb of distributed RAM, and 400 Digital Signal Processing (DSP) slices, making it suitable for a wide range of high-performance applications. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The -3 speed grade of this FPGA allows it to operate up to 500 MHz. The device comes in a flip-chip fine-pitch ball grid array (FFG665C) package with 665 pins, providing high pin-count connectivity for a variety of applications. XC5VSX50T-3FFG665C is commonly used in industrial automation, aerospace and defense, telecom, and high-performance computing applications. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it an excellent choice for mission-critical and high-reliability applications.

XCZU6CG-2FFVC900I is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA belongs to the Zynq UltraScale+ MPSoC (Multiprocessor System on Chip) family and has 62,500 System Logic Cells, operates at a speed of up to 1 GHz, and features a 6-Input Processor System (PS), 40 Mb of UltraRAM, 900 Kbyte of Block RAM, and 192 DSP Slices.

XC7VX980T-3FFG1928C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

​XCVU19P-1FSVB3824E is an FPGA (Field Programmable Gate Array) produced by Xilinx, belonging to the Virtex UltraScale+series. This FPGA has the following key features:

In 1961, Hazelting Corp. of the United States published Multiplanar, which was the first pioneer in the development of multilayer boards. This method is almost the same as the method of manufacturing multilayer boards by using the through-hole method. After Japan stepped into this field in 1963, various ideas and manufacturing methods related to multi-layer boards were gradually spread all over the world. The following is about 14 Layer High TG PCB related, I hope to help you better understand 14 Layer High TG PCB.