XCKU5P-L2FFVB676E Manufacturers

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Hot Products

  • High TG PCB

    High TG PCB

    In 1961, Hazelting Corp. of the United States published Multiplanar, which was the first pioneer in the development of multilayer boards. This method is almost the same as the method of manufacturing multilayer boards by using the through-hole method. After Japan stepped into this field in 1963, various ideas and manufacturing methods related to multi-layer boards were gradually spread all over the world. The following is about 14 Layer High TG PCB related, I hope to help you better understand 14 Layer High TG PCB.
  • XC7A75T-2FGG676C

    XC7A75T-2FGG676C

    ​XC7A75T-2FGG676C is an FPGA (Field Programmable Gate Array) chip produced by Xilinx. This chip belongs to the Xilinx 7 series FPGA, designed to meet all system requirements from low-cost, small size, cost sensitive, large-scale applications to ultra high end connection bandwidth, logic capacity, and signal processing. The XC7A75T-2FGG676C chip has the following characteristics and specifications
  • EP4SGX110FF35I4G

    EP4SGX110FF35I4G

    EP4SGX110FF35I4G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CSEMA4U23I7N

    5CSEMA4U23I7N

    ​5CSEMA4U23I7N is a SoC FPGA chip produced by Altera (now part of Intel Programmable Solutions Group). The chip is packaged in UBGA-672 and features an ARM Cortex A9 core with a dual core design. It supports a maximum clock frequency of up to 925MHz and is equipped with abundant logic elements and memory resources
  • BCM88675CB0KFSBG

    BCM88675CB0KFSBG

    BCM88675CB0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX150-3FGG900I

    XC6SLX150-3FGG900I

    XC6SLX150-3FGG900I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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