Products
Home > Products > XCKU3P-1FFVB676E

XCKU3P-1FFVB676E Manufacturers

The client satisfaction is our primary concentrate on. We uphold a consistent level of professionalism, top quality, credibility and service for XCKU3P-1FFVB676E, To significantly improve our assistance quality, our company imports a large number of international advanced devices. Welcome clients from your home and abroad to simply call and inquire!
XCKU3P-1FFVB676E, We've got constantly insisted on the evolution of solutions, spent good funds and human resource in technological upgrading, and facilitate production improvement, meeting the wants of prospects from all countries and regions.

Related Products

Hot Products

  • XCZU7CG-2FFVF1517E

    XCZU7CG-2FFVF1517E

    XCZU7CG-2FFVF1517E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2C32A-6VQG44I

    XC2C32A-6VQG44I

    XC2C32A-6VQG44I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU3P-2FFVC1517E

    XCVU3P-2FFVC1517E

    ​XCVU3P-2FFVC1517E is a high-performance FPGA based on the UltraScale architecture, produced by Xilinx. Here is a detailed introduction about XCVU3P-2FFVC1517E
  • XCVU190-3FLGA2577E

    XCVU190-3FLGA2577E

    ​XCVU190-3FLGA2577E is a high-performance FPGA chip belonging to Xilinx's Virtex UltraScale series. This chip has 2349900 logic units and 568 input/output terminals, manufactured using a 20nm process, and packaged in 2577 pin FCBGA.
  • BCM88470CB0IFSBG

    BCM88470CB0IFSBG

    ​BCM88470CB0IFSBG is based on the seventh generation Dune scalable switching product line. It can be used to build various network switching solutions with flexible I/O interfaces, such as Ethernet or OTN.
  • XA3S1200E-4FTG256Q

    XA3S1200E-4FTG256Q

    XA3S1200E-4FTG256Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • Distinguishing method of PCB single-layer board and multi-layer board

    According to the number of layers, single-sided, double-sided and multilayer circuit boards are divided according to the circuit layer inside.

  • The Function and Principle of Chips

    The main function of a chip is to complete calculations and processing tasks, and an integrated circuit is to package a circuit onto a small component.

  • What is semiconductor

    Substances and materials in nature can be divided into three categories: conductors, semiconductors and insulators according to their conductivity. The resistivity of semiconductor is in the range of 1m Ω· cm ~ 1g Ω· cm (the upper limit is taken according to Xie jiakui's electronic circuit, and 1/10 or 10 times of it; because the angle mark is not available, the current description is used temporarily)

  • What is RF PCB board?

    RF PCB, means radio frequency PCB. People also called these PCB High frequency PCB, it is for the PCB with a higher electromagnetic frequency, and it is used on the products field with high frequency. (Frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meter). It is made by microwave substrate with common PCB manufacturing process or with some special way to make.

  • HDI board application

    HDI is widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured by the build-up method.

  • XCVU9P-L2FLGA2577E is a powerful and high-performance FPGA chip

    XCVU9P-L2FLGA2577E adopts the advanced Virtex UltraScale+architecture and is a member of this series of chips.

Send Inquiry