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XCKU095-L1FFVB1760I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    EP2C70F672I8N

    ​EP2C70F672I8N is an FPGA chip produced by Altera Corporation, belonging to the Cyclone II series. This chip adopts TSMC's 90nm low-k dielectric process and is manufactured on 300mm wafers, aiming to provide fast availability and low cost while supporting complex digital systems
  • XC7Z030-2SBG485I

    XC7Z030-2SBG485I

    ​The XC7Z030-2SBG485I Zynq-7000 device is equipped with a dual core ARM Cortex-A9 processor, which is compatible with 28nm Artix7 or Kinex based processors ™ The programmable logic integration of 7 can achieve excellent performance to power ratio and maximum design flexibility. The Zynq 7000 device has a logic unit of up to 6.25M and transceivers ranging from 6.6Gb/s to 12.5Gb/s, which can achieve highly differentiated design for many embedded applications such as multi camera driver assistance systems and 4K2K ultra high definition televisions
  • XCKU15P-2FFVA1156E

    XCKU15P-2FFVA1156E

    ​Xilinx XCKU15P-2FFVA1156E Kintex® UltraScale ™ Field programmable gate arrays can achieve extremely high signal processing bandwidth in mid-range devices and next-generation transceivers. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system
  • XC6SLX75-2CSG484I

    XC6SLX75-2CSG484I

    XC6SLX75-2CSG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 20-layer PCB

    20-layer PCB

    20-layer PCB--The increase in the density of integrated circuit packaging has led to a high concentration of interconnect lines, which makes the use of multiple substrates a necessity. In the layout of the printed circuit, unforeseen design problems have appeared, such as noise, stray capacitance, and crosstalk. The following is about 20 layer Pentium Motherboard related, I hope to help you better understand 20-layer PCB.
  • XCVU13P-2FHGB2104I

    XCVU13P-2FHGB2104I

    XCVU13P-2FHGB2104I Overview of RF Data Converter Subsystem Most Zynq UltraScale+RFSoCs include an RF data converter subsystem that includes multiple radios Frequency analog-to-digital converter (RF-ADC) and multiple RF analog-to-digital converters
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    In our daily life, there are many intelligent electrical appliances that bring us many conveniences, such as floor sweeping robots, dish washing robots, cooking robots, etc. among them, these robots inevitably need PCB boards with reliable quality in the assembly process

  • Are semiconductors and chips the same concept?

    Chip is a general term for semiconductor component products. In electronics, it is a method of miniaturizing circuits (mainly including semiconductor devices and passive components) and often manufactured on the surface of semiconductor wafers. Also known as integrated circuit, microcircuit, or micro

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    The photovoltaic effect of semiconductor material is the basic principle of solar cell operation. At present, the photovoltaic application of semiconductor materials has become a hot topic and is currently the fastest growing and best developing clean energy market in the world. The main production material of solar cells is semiconductor materials,

  • Welding process of FPC circuit board

    At present, there are two general FPC welding processes, one is tin press welding, and the other is manual drag welding.

  • HDI board application

    HDI is widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured by the build-up method.

  • Why Guangdong's GDP leads the country

    Recently, the GDP data of various provinces, autonomous regions and municipalities across the country have been released one after another. In 2016, Guangdong's economy was generally stable, with a regional GDP of 79.305 billion yuan, an increase of 7.5% year-on-year. The total GDP ranked first in the country for 28 consecutive years.

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