XCKU095-2FFVA1156I Manufacturers

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XCKU095-2FFVA1156I, Our company has already have pass the ISO standard and we're fully respect our customer 's patents and copyrights. If the customer provides their own designs, We will guarantee that they will likely be the only one can have that merchandise. We hoping that with our good products can bring our customers a great fortune.

Hot Products

  • Half-hole HDI PCB

    Half-hole HDI PCB

    Half-hole HDI PCB is a compact product designed for small capacity users. It adopts modular parallel design, with a module capacity of 1000VA (height of 1U), natural cooling, and can be directly put into a 19 "rack, with a maximum of 6 modules in parallel. The product adopts full digital signal processing (DSP) technology and a number of patent technologies. It has a full range of load adaptability and strong short-term overload capacity, and can not consider the load power factor and peak factor.
  • 18 Layer Oversized size PCB

    18 Layer Oversized size PCB

    18 Layer Oversized size PCB generally refers to a circuit board with a long side exceeding 650MM and a wide side exceeding 520MM. However, with the development of market demand, many multilayer circuit boards exceed 1000MM. The following is about 18 Layer Oversized PCB related, I hope to help you better understand 18 Layer Oversized PCB.
  • High speed Graphics Card PCB

    High speed Graphics Card PCB

    It has a number of leading technologies in the industry, including: the first uses a 0.13 micron manufacturing process, has 1GHz speed DDRII memory, perfectly supports Direct X9, and so on.The following is about High speed Graphics Card PCB related, I hope to help you better understand High speed Graphics Card PCB.
  • EP4SGX180KF40C3N

    EP4SGX180KF40C3N

    EP4SGX180KF40C3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX9-2CPG196I

    XC6SLX9-2CPG196I

    ​XC6SLX9-2CPG196I is a high-performance FPGA chip produced by Xilinx. This chip has the following characteristics and specifications:
  • XC7A35T-2FGG484C

    XC7A35T-2FGG484C

    XC7A35T-2FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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