XCF01SV0G20C Manufacturers

Our pursuit and enterprise aim would be to "Always fulfill our buyer requirements". We carry on to acquire and layout excellent quality items for the two our old and new clients and realize a win-win prospect for our shoppers in addition as us for XCF01SV0G20C, Prospects first! Whatever you require, we should do our utmost to help you. We warmly welcome clients from all around the globe to cooperate with us for mutual enhancement.
XCF01SV0G20C, With the goal of "zero defect". To care for the environment, and social returns, care employee social responsibility as own duty. We welcome friends from all over the world to visit and guide us so that we can achieve the win-win goal together.

Hot Products

  • GA100-882AA-A

    GA100-882AA-A

    GA100-882AA-A is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU9CG-2FFVC900I

    XCZU9CG-2FFVC900I

    ​XCZU9CG-2FFVC900I is a high-performance FPGA chip launched by Xilinx, which integrates rich functions and powerful performance, suitable for various complex application scenarios. Here are some of the main features and functions of the chip:
  • ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.
  • XCKU060-2FFVA1156I

    XCKU060-2FFVA1156I

    The XCKU060-2FFVA1156I field programmable gate array can achieve extremely high signal processing bandwidth in mid-range devices and next-generation transceivers. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system
  • XC7S15-2FTGB196I

    XC7S15-2FTGB196I

    XC7S15-2FTGB196I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM56565B0KFSBG

    BCM56565B0KFSBG

    BCM56565B0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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