XC7Z100-2FFG900I Manufacturers

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Hot Products

  • 5AGTMC3D3F31I3G

    5AGTMC3D3F31I3G

    5AGTMC3D3F31I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM5719A1KFBG

    BCM5719A1KFBG

    BCM5719A1KFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX690T-3FFG1927I

    XC7VX690T-3FFG1927I

    XC7VX690T-3FFG1927I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX100-2FGG676I

    XC6SLX100-2FGG676I

    ​XC6SLX100-2FGG676I is an FPGA chip launched by Xilinx, belonging to the CoolRunner II series. This chip has the following characteristics and advantages:
  • XC7VX690T-3FFG1158E

    XC7VX690T-3FFG1158E

    ​XC7VX690T-3FFG1158E Field Programmable Gate Array (FPGA) IC Model: XC7VX690T-3FFG1158E Packaging: FCBGA-1158 Type: Embedded FPGA (Field Programmable Gate Array)
  • XCVU13P-3FLGA2577E

    XCVU13P-3FLGA2577E

    XCVU13P-3FLGA2577E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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