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Hot Products

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  • Rogers 4350B PCB

    Rogers 4350B PCB

    The high-frequency mixed-press printed circuit board includes an aluminum base layer and an insulating and thermally conductive layer. The circuit board is provided with mounting holes. The bottom of the aluminum base layer is bonded and connected to the carbon cladding through a silicon rubber layer. The aluminum base layer, the insulating and thermally conductive layer, and the silicon rubber layer A rubber layer is adhesively connected to the outer end of the carbon cladding, and kraft paper is bonded to the bottom of the carbon cladding, which can prevent moist moisture from contaminating it, avoiding it from being eroded, saving costs, and improving efficiency. The following is about Rogers 4350B PCB related, I hope to help you better understand Rogers 4350B PCB.
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    XCZU7CG-1FFVF1517I

    XCZU7CG-1FFVF1517I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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    V24B12T200BG

    V24B12T200BG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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    EP1K30QC208-3N

    EP1K30QC208-3N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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    XC6SLX9-2CPG196C

    XC6SLX9-2CPG196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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